CVD diamond films for thermal management applications
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2019-11-01 |
| Journal | 2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS) |
| Authors | Shusmitha Kyatam, Joana Catarina Mendes, Debarati Mukherjee, Armindo Silva, LuĆs Nero Alves |
| Institutions | University of Aveiro, Instituto de TelecomunicaƧƵes |
| Citations | 1 |
Abstract
Section titled āAbstractāOne of the stringent issues in modern electronic applications is related with the necessity of keeping the operating temperature of electronic components within safe levels. The use of passivation, board, and encapsulation materials with large thermal conductivity provides an efficient way of removing the excess heat without increasing the volume and weight of the electronic circuitry. Following this trend, diamond films deposited by chemical vapor deposition (CVD) offer a simple and efficient solution to maintain the operating temperature within safe limits. This paper discusses the use of CVD diamond films with HEMT devices, photonic integrated circuits and high power LEDs.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal SourceāReferences
Section titled āReferencesā- 2014 - Direct Integration of Diamond Heat Spreader with GaN-Based HEMT Device Structures e ain
- 1994 - A proposed novel application of thin overlay diamond films for improved thermal management budget of short gate high power devices