A Highly Linear Dual-Stage Amplifier With Beyond 1.75-THz Gain–Bandwidth Product
At a Glance
Section titled “At a Glance”| Metadata | Details |
|---|---|
| Publication Date | 2021-03-18 |
| Journal | IEEE Microwave and Wireless Components Letters |
| Authors | T. Shivan, Maruf Hossain, Ralf Doerner, Hady Yacoub, Tom K. Johansen |
| Institutions | Technical University of Denmark, Ferdinand-Braun-Institut |
| Citations | 5 |
Abstract
Section titled “Abstract”<p>This work reports a multi-purpose highly linear ultra-wideband amplifier with a gain bandwidth product (GBP) of 1.75 THz, the highest reported in any MMIC process. A transimpedance amplifier is cascaded with a distributed amplifier, emulating a receiver subsystem. Using a diamond heat spreader, to dissipate heat from transistors, the cascaded amplification subsystem can achieve very high OIP3 from 20 to 24 dBm when measured between 5 to 65 GHz. A small signal average gain of 24 dB is observed over a frequency range exceeding the maximum measurable bandwidth from DC to 110 GHz. Compared with other ultra-wideband MMIC amplifiers beyond 110 GHz bandwidth, the circuit offers a unique combination of high linearity (OIP3) and high gain. As a result, the cascaded amplifier is suitable for applications in optical-electrical converters, spectroscopy and ultrawideband measurement systems in the sub-THz frequency range.</p>
Tech Support
Section titled “Tech Support”Original Source
Section titled “Original Source”References
Section titled “References”- 2021 - Modeling of InP DHBTs in a transferred-substrate technology with diamond heat spreader
- 2012 - An ultra-broadband low-noise traveling-wave amplifier based on 50 nm InGaAs mHEMT technology
- 2018 - An ultra-broadband low-noise distributed amplifier in InP DHBT technology