Fabrication of Functionally Graded Diamond/Al Composites by Liquid–Solid Separation Technology
At a Glance
Section titled “At a Glance”| Metadata | Details |
|---|---|
| Publication Date | 2021-06-10 |
| Journal | Materials |
| Authors | Hongyu Zhou, Yaqiang Li, Huimin Wang, Minrui Ran, Zhi Tong |
| Institutions | University of Science and Technology Beijing |
| Citations | 9 |
Abstract
Section titled “Abstract”The electronic packaging shell, the necessary material for hermetic packaging of large microelectronic device chips, is made by mechanical processing of a uniform block. However, the property variety requirements at different positions of the shell due to the performance have not been solved. An independently developed liquid-solid separation technology is applied to fabricate the diamond/Al composites with a graded distribution of diamond particles. The diamond content decreases along a gradient from the bottom of the shell, which houses the chips, to the top of the shell wall, which is welded with the cover plate. The bottom of the shell has a thermal conductivity (TC) of 169 W/mK, coefficient of thermal expansion (CTE) of 11.0 × 10−6/K, bending strength of 88 MPa, and diamond content of 48 vol.%. The top of the shell has a TC of 108 W/mK, CTE of 19.3 × 10−6/K, bending strength of 175 MPa, and diamond content of 15 vol.%, which solves the special requirements of different parts of the shell and helps to improve the thermal stability of packaging components. Moreover, the interfacial characteristics are also investigated. This work provides a promising approach for the preparation of packaging shells by near-net shape forming.
Tech Support
Section titled “Tech Support”Original Source
Section titled “Original Source”References
Section titled “References”- 2014 - Emerging challenges and materials for thermal management of electronics [Crossref]
- 2020 - Guiding heat in active thermal management: One-pot incorporation of interfacial nano-engineered aluminium/diamond composites into aluminium foams [Crossref]
- 2020 - Construction of 3D interconnected diamond networks in Al-matrix composite for high-efficiency thermal management [Crossref]
- 2020 - A review on fabrication methods, reinforcements and mechanical properties of aluminum matrix composites [Crossref]
- 2018 - The fabrication of functional gradient hypereutectic Al-Si composites by liquid-solid separation technology [Crossref]
- 2015 - Preparation and thermodynamic analysis of the porous ZrO2/(ZrO2 + Ni) functionally graded bolted joint [Crossref]
- 2016 - On the high temperature mechanical behaviors analysis of heated functionally graded plates using FEM and a new third-order shear deformation plate theory [Crossref]
- 2010 - Microstructure and thermal properties of Diamond-Al composite fabricated by pressureless metal infiltration [Crossref]
- 2019 - Interfacial products and thermal conductivity of diamond/Al composites reinforced with ZrC-coated diamond particles [Crossref]
- 2017 - Mo2C coating on diamond: Different effects on thermal conductivity of diamond/Al and diamond/Cu composites [Crossref]