Three-dimensional imaging of integrated-circuit activity using quantum defects in diamond
At a Glance
Section titled âAt a Glanceâ| Metadata | Details |
|---|---|
| Publication Date | 2024-01-29 |
| Journal | Physical Review Applied |
| Authors | Marwa Garsi, Rainer Stöhr, Andrej Denisenko, Farida Shagieva, Nils Trautmann |
| Institutions | University of Stuttgart, Carl Zeiss (Germany) |
| Citations | 27 |
Abstract
Section titled âAbstractâThree-dimensional semiconductor chip architectures promise high-density memory and much faster computation, but self-heating and leakage currents still severely limit performance. While current-density mapping is crucial to studying these issues in situ, nondestructive imaging has been limited to two dimensions. The authors use ensembles of nitrogen-vacancy centers in diamond as nanoscale quantum sensors to probe all three vectorial components of magnetic fields associated with electric currents, for noninvasive imaging of three-dimensional currents in multilayer integrated circuits. Further improvements could reveal the local conductance of materials, to advance condensed matter physics.