Investigation of Cu-diamond/Cu-diamond-high-entropy alloys bi-layer coating via mechanical alloying
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2024-02-01 |
| Journal | Surface Engineering |
| Authors | Tao Sun, Jiajun Zang, Zhihui Yang, Yifu Shen |
| Institutions | Nanjing University of Aeronautics and Astronautics |
| Citations | 1 |
Abstract
Section titled āAbstractāIn this work, Cu-diamond/Cu-diamond-Cu 2 NiAlAgZn bi-layer coatings were prepared via mechanical alloying on copper substrate, in which Cu-diamond was the inner layer and Cu-diamond-Cu 2 NiAlAgZn was the outer layer. The results revealed that the quinary alloy Cu 2 NiAlAgZn HEAs has simple FCC solid solution structure and the interface of bi-layer coating is identifiable. The inner gray area consisted of a Cu-diamond composite, while the outer gray area was a Cu 2 NiAlAgZn HEAs reinforced Cu matrix composite. However, there were some defects in the microstructure and the compactness was not satisfactory. Therefore, recrystallization annealing treatment was performed on the bi-layer coatings. The microhardness distribution from the substrate to the coating showed the characteristics of āincrease-drop-increaseā before and after heat treatment. Although the microhardness slightly decreased, heat treatment resulted in a denser coating and eliminated defects. Moreover, the thermal and electrical conductivity of the sample that have undergone heat treatment significantly increased.