Machining Characteristics of Micro EDM of Silicon Carbide
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2024-02-01 |
| Journal | Journal of the Korean Society for Precision Engineering |
| Authors | Ju Hyeon Lee, Chan Young Yang, Bo Hyun Kim |
| Citations | 2 |
Abstract
Section titled āAbstractāSilicon carbide (SiC) is chemically stable, highly heat-resistant, and resistant to thermal shock. SiC having excellent characteristics in a high temperature and high voltage environment is used in high-power semiconductors, highprecision mechanical devices, optical components, etc. As it is used in various industries, there is a growing demand for processing fine holes or grooves in silicon carbide. In this study, micro holes and grooves were machined on 4HSiC and sintered SiC using electrical discharge machining (EDM). Silicon carbide which has very high hardness can be easily processed by EDM as compared with mechanical processes. As a tool material, a polycrystalline diamond (PCD) which has high wear resistance was used and a micro tool of a diameter of 100 Ī¼m was fabricated by wire electrical discharge grinding (WEDG). In the EDM of SiC, the machining characteristics such as surface roughness, discharge gap, and tool wear were investigated.