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Quantum Diamond Microscopy for Semiconductor Failure Analysis

MetadataDetails
Publication Date2025-02-01
JournalEDFA Technical Articles
AuthorsMarwa Garsi, Andreas Welscher, Manuel Schrimpf, Bartu Bisgin, M. Hanke

Abstract Quantum diamond microscopy is an innovative nondestructive tool. This article describes detailed operations from a failure analyst’s perspective, showing how the technique integrates into standard workflows. Case histories are included comparing its performance to established FA methods and highlighting QDM’s specific advantages.