Investigation of grain strength and interfacial microstructure in the brazed joint of boron-doped diamond
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2015-01-01 |
| Journal | Diamond & Abrasives Engineering |
| Authors | D. W. Dawe |
| Institutions | Nanjing University of Aeronautics and Astronautics |
| Citations | 1 |
Abstract
Section titled āAbstractāThe interfacial microstructure of boron-doped diamond brazed with Ag-Cu-Ti alloy,was studied by means of SEM,EDS,XPS.Theory of thermodynamic was applied to analyze the microstructure diffusion mechanism,the structure and growth process of reaction product.Additionally,the static and impact strength of grain was tested under different conditions.The results showed that in the process of vacuum brazing,TiC was preferentially generated in front of the diffusion.As time went on,TiB2 was formed through combination reaction.Due to the similar thermal expansion coefficients between TiC and TiB2,composite structure of TiB2-TiC would be formed and the thermal stress reduced,which resulted in the metallurgical bonding between the grains and the filler.After brazing,the static and impact strength of boron-doped diamond increased by 5.4% and 34.8%,respectively.In addition,with the good self-sharpening ability,the brazed boron-doped diamond tool would have a predictable application in difficult-to-cut materials.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal Sourceā- DOI: None