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Effect of the Control of Bowing in Free-standing GaN by Mechanical Polishing

MetadataDetails
Publication Date2015-12-01
JournalJournal of the Korean Institute of Electrical and Electronic Material Engineers
AuthorsJinwon Gim, Hoki Son, Tae-Young Lim, Mijai Lee, Jinho Kim
InstitutionsKorea Institute of Ceramic Engineering and Technology
Citations1

In this paper, we have studied the effect of mechanical polishing to Ga-polar face for reducing the wafer bowing and strain in free-standing GaN. After the mechanical polishing to Ga-polar face, the bowing of the free-standing GaN substrate significantly decreased with increasing the size of diamond slurry, and eventually changed the bowing direction from concave to convex. Furthermore, the full width at half maximum (FWHM) of high-resolution X-ray diffraction (HR-XRD) were decreased, especially the FWHM of (1 0 2) reflection for <TEX>$1.0{\mu}m$</TEX> size of diamond slurry was significantly decreased from 630 to 203 arcsec. In the case, we confirmed that the compressive strain in Ga-polar face was fully released by Raman measurement.