Understanding on the Correlation between Mechanical Properties and Thermal Conductivity of Hot‐Forged Copper/Diamond Composites
At a Glance
Section titled “At a Glance”| Metadata | Details |
|---|---|
| Publication Date | 2024-11-01 |
| Journal | Advanced Engineering Materials |
| Authors | Shanquan Jia, Jingnan Ma, L. Bolzoni, Fei Yang |
| Institutions | University of Waikato |
| Citations | 3 |
Abstract
Section titled “Abstract”Evaluation of the mechanical properties of copper/diamond composites is necessary for understanding the interfacial bonding, which is important for the interface thermal conductance and thermal conductivity of the composites. The tensile and three‐point bending tests are conducted on the hot‐forged copper/diamond composites using Cr powder additives and Cr‐coated diamond. The interfacial bonding strength of the composites is calculated and evaluated based on the tensile results. The fracture mechanisms of the fabricated copper/diamond composites are discussed and compared. The highest tensile strength (69 MPa) and interface bonding strength (0.043 J m −2 ) are achieved for the Cu-3Cr‐55vol% diamond composite hot‐forged under 1050 °C. The connection between the composite’s interfacial bonding strength and its thermal conductivity is elaborated.